Bild | KEY Part # / Hersteller | Beschreibung / PDF | Menge / Anfrage |
---|---|---|---|
Samsung Semiconductor |
eMMC 5.1 32 GB 1.8 / 3.3 V HS400 11.5 x 13 x 0.8 mm -40 ~ 85 °C Mass Production. |
15623Stück Lager |
|
Samsung Semiconductor |
eMMC 5.1 32 GB 1.8 / 3.3 V HS400 11.5 x 13 x 0.8 mm -40 ~ 105 °C Mass Production. |
23832Stück Lager |
|
Samsung Semiconductor |
eMMC 5.1 64 GB 1.8 / 3.3 V HS400 11.5 x 13 x 0.8 mm -25 ~ 85 °C Mass Production. |
18870Stück Lager |
|
Samsung Semiconductor |
eMMC 5.1 64 GB 1.8 / 3.3 V HS400 11.5 x 13 x 0.8 mm -25 ~ 85 °C Mass Production. |
21916Stück Lager |
|
Samsung Semiconductor |
eMMC 5.1 64 GB 1.8 / 3.3 V HS400 11.5 x 13 x 0.8 mm -25 ~ 85 °C Sample. |
25787Stück Lager |
|
Samsung Semiconductor |
eMMC 5.1 64 GB 1.8, 3.3 V / 3.3 V HS400 11.5 x 13 x 1.0 mm -25 ~ 85 °C Mass Production. |
22900Stück Lager |
|
Samsung Semiconductor |
eMMC 5.1 64 GB 1.8 / 3.3 V HS400 11.5 x 13 x 1.2 mm -40 ~ 85 °C Mass production. |
23073Stück Lager |
|
Samsung Semiconductor |
eMMC 5.1 64 GB 1.8 / 3.3 V HS400 11.5 x 13 x 1.2 mm -40 ~ 105 °C Mass production. |
19489Stück Lager |
|
Samsung Semiconductor |
eMMC 5.0 64 GB 1.8 / 3.3 V HS400 11.5 x 13 x 1.0 mm -40 ~ 85 °C Mass Production. |
14184Stück Lager |
|
Samsung Semiconductor |
eMMC 5.0 64 GB 1.8 / 3.3 V HS400 11.5 x 13 x 1.0 mm -40 ~ 105 °C Mass Production. |
24629Stück Lager |
|
Samsung Semiconductor |
eMMC 5.1 64 GB 1.8 / 3.3 V HS400 11.5 x 13 x 1.0 mm -40 ~ 85 °C Mass Production. |
27174Stück Lager |
|
Samsung Semiconductor |
eMMC 5.1 64 GB 1.8 / 3.3 V HS400 11.5 x 13 x 1.0 mm -40 ~ 105 °C Mass Production. |
21686Stück Lager |
|
Samsung Semiconductor |
eMMC 5.1 128 GB 1.8 / 3.3 V HS400 11.5 x 13 x 1.0 mm -25 ~ 85 °C Mass Production. |
25983Stück Lager |
|
Samsung Semiconductor |
eMMC 5.1 128 GB 1.8 / 3.3 V HS400 11.5 x 13 x 1.0 mm -25 ~ 85 °C Sample. |
24554Stück Lager |
|
Samsung Semiconductor |
eMMC 5.1 128 GB 1.8 / 3.3 V HS400 11.5 x 13 x 1.2 mm -40 ~ 85 °C Mass production. |
17647Stück Lager |
|
Samsung Semiconductor |
eMMC 5.1 128 GB 1.8 / 3.3 V HS400 11.5 x 13 x 1.2 mm -40 ~ 105 °C Mass production. |
26752Stück Lager |
|
Samsung Semiconductor |
eMMC 5.1 256 GB 1.8 / 3.3 V HS400 11.5 x 13 x 1.0 mm -25 ~ 85 °C Mass Production. |
14292Stück Lager |